In our latest Fireside Chat, we sit down with Jayraj Nair, Field CTO for High-Tech and APAC at Ansys, to dive deep into the future of semiconductor innovation.
Following our first discussion on broad industry trends, today we take a closer look at heterogeneous chip design, the importance of multiphysics and multi-domain simulation, and the critical need for new engineering skillsets in a rapidly transforming landscape.
Jayraj shares insights into how simulation has evolved from just a verification tool to a key enabler of cutting-edge innovation. We explore the complexities of multi-die architectures, the impact of thermal and electromagnetic performance on chip reliability, and how engineering education must adapt to meet new challenges.
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